Quotations
turned within 24-Hours on types I, II, III and IV flexible
circuitry having both GF and GI construction, up to twenty [20]
layers, within a fully compliant and certified MIL-P-550884C
environment. Complete CAD/CAM capability offering .007 tracks
and .005 spacing with lead times ranging between one and two
weeks for single sided and double sided, plated through hole
technology and two to three weeks for multilayer and rigid-flex
designs.
HVRFLEX: HVRFlex is a prorietary and patented all FR4 epoxy
glass constuction, using all the same materials used by printed
wiring board manufacturers and all the same processes.
Therefore, electrical and physical properties are exactly the
same as any other conventional multilayer PWB and performance in
the assembly process is the same as any other board. HVRFlex has
a minimal cost impact over the comparable multilayer boards as
opposed to the typical rigid-flex printed wiring boards which
cost 3-4 times more than comparable multilayers. The additional
saving realized from connector and cable elimination between
boards further cost-justifies HVRFlex uses. With accelerated
lead times comparable to conventional multilayer boards, this is
how to stuff 10 pounds of electronics into 5 pound box! |
